Manufacturing
Facility

  • World class manufacturing facility
  • Secured and climate monitored
  • ESD controlled

Equipment

 
Philips SMT Lines
  • Complete range of component technology from 0402 to QFP and BGA including 12 mil pitch and micro BGA.
  • Capable of handling PCBs up to 14.5" x 20"

MPM screen printers w/ Vision overlay technology
  • Capable of handling PCBs up to 14.5" x 20"
  • Capable of 12 mil pitch

Conceptronic Hot Air Convection Reflow Ovens
  • "HVA70" & "HVA102" models with Datapaq profiling

Dover Soltec "Delta System" Wave Soldering Machine
  • Chip wave technology

Electrovert Aqueous In-line Cleaning System
  • Closed loop system

Teradyne (In-Circuit Tester)
  • In house certified programmer

Complete Test Station for Functional Testing

Dage X-Ray System
  • XL6500, the XL-6500 inspection system provides x-ray images at oblique angles from 0 thru 45 degrees

AIR-VAC Rework Station
  • Provides features necessary to handle a wide array of packaging designs, including BGA, CSP's, FlipChip, fine pitch QFP's, plastic sockets, PLCC's, BGA Sockets, BGA Connectors and surface mounted connectors.

Royonix Auto Insertion Technology

Electroprep/ Hepco Radial and Axial Lead Formers

eM Power PCB Assembly and Test
  • Is the end-to-end solution for collaboratively creating, optimizing, and managing PCB New Product Introduction (NPI) and test processes.
  • Our eMPower PCB Assemblly and Test software introduces new products to the shop floor quickly, accurately, and cost-effectively.